Electronics Packaging Training Courses and Workshops

Schools providing training courses, certificates, diplomas or degree programs of Electronics Packaging




Total 26 training courses and degree programs available around the world.

CHIPSCALE PACKAGING

Course Format: Public Course / Instructor-Led / Open Enrollment
School/Trainer: The University of Texas at Arlington
Training Center(s)/Venue(s): Arlington, United States

Overview of area array packaging with special emphasis on the maturing chipscale packaging technology. Topics covered will include the design concepts of this technology, the materials related aspects, the manufacturing processes, and their reliability in a variety of applications.


Integrated Circuit Packaging

Course Format: Public Course / Instructor-Led / Open Enrollment
School/Trainer: University of Texas at Dallas
Training Center(s)/Venue(s): Dallas, United States

Basic packaging concepts, materials, fabrication, testing, and reliability, as well as the basics of electrical, thermal, and mechanical considerations as required for the design and manufacturing of microelectronics packaging. Current requirements and future trends will be presented. General review of analytical techniques used in the evaluation and failure analysis of microelectronic packages.

Integrated Circuit Manufacture Processing

Course Format: Public Course / Instructor-Led / Open Enrollment
School/Trainer: International Technological University
Training Center(s)/Venue(s): San Jose, United States
  V

The course will focus on principles of IC fabrication processes. It will introduce principles and practical aspects of fabrication of devices for MOS and bipolar integrated circuits, semiconductor and process materials, crystal growth and wafer preparation, contamination control and yield, oxidation, rapid thermal processing, photolithography, steppers, X-ray &, e-beam lithography, chemical mechanical polishing, doping, ion implantation, deposition (PVD, CVD, Epi), etching, metallization, wafer testing, formation of various devices, manufacturing technology and packaging.

Component Identification: Packaging & Handling (Certificate)

Course Format: Online / Virtual Classroom / Webinar
School/Trainer: Automated Learning Corporation
Training Center(s)/Venue(s): Kanata, Canada
  V

One of a series of short interactive multimedia courses on component identification. This course introduces packaging and handling for electronic assembly operators and others, who deal with electronic components in their work. You can &,quot,mix and match&,quot, courses within the component identification series to create a custom curriculum to meet your training needs. Courses are available for individual or company purchase.


Packaging &, Handling

Course code: CID-PH

Course Content

General handling procedures &, precautions
Labels for special handling
ESD, Moisture Sensitive, Lead-Free
Packaging types, Tape &, Reel, Tray, Tube, Bulk
Bill of materials, Bar coding
Need for traceability
Critical information only available on packaging



IC Packaging

Course Format: Public Course / Instructor-Led / Open Enrollment
School/Trainer: Nanyang Technological University
Training Center(s)/Venue(s): Singapore, Singapore
  V

This course aims to provide a deep understanding of the fundamental principles underlying the core
technology of integrated circuit (IC) packaging for graduate students, and build-up their ability in IC
packaging design, materials, thermal management, fabrication and characterisation.
DESIRED OUTCOME
After pursuing the course, we expect students to have
(i) A good knowledge on the fundamental theories, design, simulation, and fabrication processes
relating to IC packaging for different applications;
(ii) Motivation to apply IC packaging design and innovation to applications of their own interests
and relate to their own individual research and development areas.

Design Of Electronic Packaging and Interconnects

Course Format: Public Course / Instructor-Led / Open Enrollment
School/Trainer: North Carolina State University
Training Center(s)/Venue(s): Raleigh, United States
  V

A study of the design of digital and mixed signal interconnect and packaging. Topics covered include: Single chip (surface mount and through-hole) and multi-chip module packaging thecnology; packaging techology selection; thermal design; electricaldesign of printed circuit board, backplane and multi-chip module interconnect; receiver and driver selection; EMI control; CAD tools; and measurement issues.

Electronics Packaging (Certificate)

Course Format: On-Site / In-House / Private Tutoring
School/Trainer: TWI Training & Certification Services UK
Training Center(s)/Venue(s): Aberdeen, Cambridge, Middlesbrough, Port Talbot, Rotherham, United Kingdom
  V

The course will provide attendees with an intensive introduction to the processes used in the manufacture of microelectronic devices and will cover: die attachment adhesive, solder and alternatives; interconnection methods; wire bonding and flip-chip processes; device protection; hermetic sealing and encapsulation.

All processes covered will include a study of material selection; equipment; process control; inspection; rework; reliability and failure mechanisms.

Objectives:
•to review the range of available techniques and materials for initial attachment of silicon devices to substrates
•to ensure best practice in manufacturing using die attachment

Assembly and Packaging

Course Format: Public Course / Instructor-Led / Open Enrollment
School/Trainer: Santa Ana College Centennial Education Center
Training Center(s)/Venue(s): Santa Ana, United States

Varies according to topic. Specialized
courses on topics related to the needs of
the students in the assembly and packaging
program.

Characterization, Packaging and Testing of Nanofabrication Structures

Course Format: Public Course / Instructor-Led / Open Enrollment
School/Trainer: Delaware County Community College
Training Center(s)/Venue(s): Downingtown, Media, Sharon Hill, Exton, Jennersville, United States
  V

This course examines a variety of techniques and measurements essential for controlling device fabrication and final packaging. Students will revisit concepts such as residual gas analysis introduced in TEL 261, optical emission spectroscopy (OES) and end point detection as introduced in TEL 263. Characterization techniques such as surface profilometry, advanced optical microscopy, optical thin film measurements, ellipsometry, and resistivity/conductivity measurement will be implemented on nanofabricated samples. Basic electrical measurements on device structures for yield analysis and process control will also be stressed. These will include breakdown measurements, junction testing, and C-V and I-V tests and simple transistor characterization. In addition, students will examine mechanical as well as electrical characterizations of nanostructures for biological/biomedical applications. The students will perform DNA analysis by learning and performing the polymerase chain reaction for DNA replication. They will also study and manufacture microfluid channels for biological an... [Read More]

BTEC Level 3 Extended Diploma in Electronic Engineering

Course Format: Public Course / Instructor-Led / Open Enrollment
School/Trainer: Liverpool Community College
Training Center(s)/Venue(s): Liverpool, United Kingdom
  V

BTEC Diplomas are vocational courses involving practical and theory based work. You will learn by completing projects and assignments that are based on realistic workplace situations, activities and demands. As well as learning about the employment area you are interested in, you will develop the skills you need to start and/or further develop your education and career.
Core units you may study include - Electronic / Electrical Principles, Business Systems, Maths for Technicians, Communications, Project, and Health and Safety.

Specialist units you may study include - Analogue Electronics, Digital Electronics, Micro Electronics, Electronic Fault Finding, Electronic Circuit Manufacture, Further Electrical Principles, Programmable Logic Controllers, etc.
In terms of alternative and future employment prospects, the Engineering Department will support students trying to obtain work placements in the Engineering industry.

Higher National Certificate in Electrical and Electronic Engineering

Course Format: Public Course / Instructor-Led / Open Enrollment
School/Trainer: Liverpool Community College
Training Center(s)/Venue(s): Liverpool, United Kingdom
  V

This course is aimed at people of all ages working or aiming to work in a technical or supervisory position within a variety of electrical and electronic engineering fields. It is designed to develop the knowledge and the understanding of areas such as:
Electrical and Electronic and Digital Principles, Engineering Science, Engineering Design, Analytical Methods for Engineering, Project Design, Business Improvement Techniques or Quality and Business Improvement, Programmable Logic Controllers, Electrical Power, Electronic Principles and Utilisation of Electrical Energy, Combination and Sequential Logic, Instrumentation and Control Principles.

Embedded Systems (Master Degree)

Course Format: Public Course / Instructor-Led / Open Enrollment
School/Trainer: University of Hull
Training Center(s)/Venue(s): Kingston upon Hull, United Kingdom
  V

This MSc is for students who wish to study a programme to engage them in system development and design focussing on microcontrollers, both hardware and software. It provides advanced knowledge in areas essential for this type of design and development, while also providing learning in areas closely associated to embedded systems, such as control and communications.

Programme content
The programme’s aims and objectives are to

impart knowledge of electronic systems design based around microcontrollers

develop the ability to manage new technologies and integrate them into system design

satisfy the growing demand for engineers with embedded systems experience

facilitate your professional development and enhance your career prospects

Digital ASIC Design

Course Format: Public Course / Instructor-Led / Open Enrollment
School/Trainer: Lakehead University
Training Center(s)/Venue(s): Thunder Bay, Canada

Digital Application-Specific Integrated Circuit (ASIC) Design Flow, hardware description language, synthesis of CMOS logic, standard cell libraries, verification, simulation, and testing, IC packaging, field programmable gate arrays and mask programmable gate arrays. Computer Aided Design algorithms.

Electronics

Course Format: Public Course / Instructor-Led / Open Enrollment
School/Trainer: Lakehead University
Training Center(s)/Venue(s): Thunder Bay, Canada

Semiconductor materials; the p-n junction; diode circuits; rectifiers and power supplies; safety in the work place; bipolar junction transistors (BJT’s) and field effect transistors (FET’s); biasing circuits and stabilization; small signal amplifier analysis; multistage amplifiers; frequency response of small signal amplifiers.

Semiconductors

Course Format: Public Course / Instructor-Led / Open Enrollment
School/Trainer: The Australian National University
Training Center(s)/Venue(s): Canberra, Australia
  V

This course introduces semiconductor physics, devices and technology. Physics topics comprise basic semiconductor physics, diodes, solar cells and transistors. Technology topics comprise oxidisation, diffusion, ion implantation, photolithography, film deposition, electrical interconnection, characterisation, packaging and process integration.

Learning Outcomes: By the end of this course, you should be able to:

Understand basic semiconductor physics
Understand how diodes, solar cells and transistors work
Understand basic semiconductor technology
Be able to relate technology to the physics of semiconductor devices
Have understanding of the context and use of semiconductor devices

PCB DSP DSC ASIC FPGA VLSI EDA (Certificate)

Course Format: Public Course / Instructor-Led / Open Enrollment
School/Trainer: Seneca College of Applied Arts and Technology
Training Center(s)/Venue(s): King City, Markham, Toronto, Canada
  V

The AED program is a career-focused supplement to your existing post-secondary education or relevant work experience in electronics or engineering technology.

In it you’ll learn the fundamental design and product development concepts necessary for participants to enhance their understanding of product design, or facilitate a transition from one area of engineering technology to another. Your courses will also help deepen your understanding of both analog and digital engineering principles as applied in modern product engineering technology.

Focusing on the application of Wireless Communications, your studies will also include treatment of the following design fundamentals Printed Circuit Board (PCB), Applications Specific Integrated Circuits (ASIC), Statistics and Quality Management, Field Programmable Gate Arrays (FPGA), Advanced Real Time Microprocessors, Digital Signal Processing (DSP), and Safety Certification and Approvals.

You’ll use industry-standard software and hardware tools to learn current industry design methodology, help foster an awa... [Read More]

IC Packaging Technology and Metallurgy

Course Format: On-Site / In-House / Private Tutoring
School/Trainer: Semitracks, Inc.
Training Center(s)/Venue(s): Albuquerque, United States
  V

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today’s microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry’s ability to track something known as Moore’s Law. Moore’s Law states that an integrated circuit’s processing power will double every two years. This has been accomplished by making devices smaller and smaller. The industry is also pushing to use semiconductor devices in an increasing array of applications. To accomplish this, the industry is also driving prices down. This has created a number of challenges related to the packaging of these components. IC Packaging Technology and Metallurgy is a 2-day course that offers detailed instruction on the technology issues associated with today’s semiconductor packages.

What You’ll Learn
We emphasize current package technology issues like lead-free solders, low-k dielectrics, and tools for package analysis. Participants learn basic but ... [Read More]

Advanced Thermal Management and Packaging Materials

Course Format: On-Site / In-House / Private Tutoring
School/Trainer: Semitracks, Inc.
Training Center(s)/Venue(s): Albuquerque, United States
  V

By using a combination of instruction by lecture, problem solving and question/answer sessions, participants will learn practical approaches to choosing the appropriate materials. From the very first moments of the seminar until the last sentence of the training, the driving instructional factor is application. Our instructors are internationally recognized experts in their fields and have years of experience (both current and relevant). The course notes offer hundreds of pages of reference material the participants can use back at their daily activities.

Course Outline

Introduction
Thermal Management Problem and Packaging Problems
Heat Dissipation, Thermal Stresses, Warping
Weight
Microprocessors
Power Modules
High-Power RF
Layer Diodes
Light-Emitting Diodes (LEDs)
Plasma Displays
Liquid Crystal Displays
Mobile Electronics
MEMS Packages
High-Power Laser and RF Weapons
Solutions
Advanced Thermal Materials
Thermally-Conductive, Low-CTE PCBs
Combined Cooling Architectures
Packaging Functions Read More]

Polymers

Course Format: Online / Virtual Classroom / Webinar
School/Trainer: Semitracks, Inc.
Training Center(s)/Venue(s): Albuquerque, United States
  V

Mechanical Behavior of Solids

This section covers the mechanical behavior of polymers. This includes properties like glass transition temperature, the coefficient of thermal expansion, fracture toughness, elastic modulus, viscoelastic behavior, adhesion, peel strength, and water absorption.
Polymer Case Studies

This section covers three case studies involving problems with polymers in electronics applications. They include a coefficient of thermal expansion problem with a connector between a board and a daughtercard, degradation of a thermal interface material that holds a cooling pipe network in a package, and a delamination problem associated with water uptake in a polymer.
Specialty Polymers in Electronics

This section covers polymers that are used in semiconductor packaging applications. They include polyimides and liquid crystalline polymers. The chemical composition, shape, and properties are discussed.

System-on-a-Chip vs. System-in-a-Package

Course Format: Online / Virtual Classroom / Webinar
School/Trainer: Semitracks, Inc.
Training Center(s)/Venue(s): Albuquerque, United States

This material covers issues related to System on a Chip (SoC) and System in a Package (SiP). Both technologies have their advantages and disadvantages.

System-on-a-Chip vs. System-in-a-Package

This section describes System-on-a-Chip (SOC) and System-in-a-Package (SIP) integration approaches. It highlights the advantages and disadvantages of each one.

Pages: 1 2


Find Electronics Packaging training courses, certificates, diplomas and degrees in Countries:



Australia - Canada - India - Indonesia - Ireland - Malaysia - Pakistan - Philippines - Singapore - South Africa - United Arab Emirates - United Kingdom - United States



Tips:
Want to find a place to stay close to the school? Or homestay in a different country? Try the house rental message board where you can search for roommates and post shared rooms or apartments for rent.



Electronics
Electronics Packaging
- Online/E-learning -
Electronics Packaging
Ask for Training
Add Courses